作者:标准资料网 时间:2024-05-03 01:41:26   浏览:8078   来源:标准资料网

【英文标准名称】:Metalliccoatingsonnonmetallicbasismaterials-Measurementofcoatingthickness-Microresistivitymethod
【原文标准名称】:非金属基底材料上的金属覆层.覆层厚度的测量.微电阻率法
【标准号】:BSEN14571-2005
【标准状态】:现行
【国别】:英国
【发布日期】:2005-05-03
【实施或试行日期】:2005-05-03
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:基底材料;校准;覆层厚度;涂层;铜;电性质和电现象;层厚度测量;测量;测量仪器;金属材料;方法;不导电的;无损的;精密度;印制电路板;电阻测量;电阻器;银;规范(验收);表面粗糙度;表面;测试
【英文主题词】:Basematerials;Calibration;Coatingthickness;Coatings;Copper;Electricalpropertiesandphenomena;Layerthicknessmeasurement;Measurement;Measuringinstruments;Metallicmaterials;Methods;Nonconducting;Non-destructive;Precision;Printed-circuitboards;Resistancemeasurement;Resistors;Silver;Specification(approval);Surfaceroughness;Surfaces;Testing
【摘要】:Thisdocumentdescribesamethodfornondestructivemeasurementsofthethicknessofconductivecoatingsonnonconductivebasematerials.Thismethodisbasedontheprincipleofthesheetresistivitymeasurementandisapplicabletoanyconductivecoatingsandlayersofmetalandsemiconductormaterials.Ingeneral,theprobehastobeadjustedtotheconductivityandthethicknessoftherespectiveapplication.However,thisdocumentfocussesonmetalliccoatingsonnonconductivebasematerials(e.g.Copperonplasticsubstrates,printedcircuitboards).NOTE1Thismethodalsoappliestothemeasurementofthrough-holecopperthicknessofprintedcircuitboards.However,forthisapplicationaprobegeometrydifferentfromtheonedescribedinthisdocumentisnecessary.NOTE2Thismethodisalsoapplicableforthicknessmeasurementsofconductivecoatingsonconductivebasematerials,iftheresistivityofthecoatingandthebasematerialisdifferent.Thiscaseisnotconsideredinthisdocument.
【中国标准分类号】:A29
【国际标准分类号】:17_040_20;25_220_40
【页数】:14P;A4
【正文语种】:英语